lintec d-175 datasheet
「lintec d-175 datasheet」熱門搜尋資訊
「lintec d-175 datasheet」文章包含有：「ADWILLkatalog2020」、「DSeries紫外線硬化型切割膠帶」、「DicingTapeLine」、「lintecD175datasheet&applicationnotes」、「TAIKO晶圓用切割膠帶」、「Technicaldatasheetdownload」、「UVCur」、「UVCurableDicingTape」、「UVtapeD」
查看更多
ADWILL katalog 2020
https://www.linteceurope.com
Adwill is LINTEC's product series for semiconductor-related adhesive tapes and equipment. The Adwill portfolio includes. UV-curable dicing tapes, high.
D Series 紫外線硬化型切割膠帶
https://www.lintec.com.tw
各製程之膠帶用途. Adwill D Series可因應作業製程而改變特性的劃時代紫外線硬化型切割膠帶(UV Curable Dicing Tape)。
Dicing Tape Line
https://www.lintec.com.tw
Equipment used with Dicing Tape. 紫外線硬化型切割膠帶. 代表產品Primal Product Name. 用途Application. 特徵Feature. 基材Base Material. D-176D / D-175D*.
lintec D175 datasheet & application notes
https://www.datasheetarchive.c
lintec D175 datasheet, cross reference, circuit and application notes in pdf format.
TAIKO晶圓用切割膠帶
https://www.lintec.com.tw
產品名稱. D-171D. D-174D. D-175D*. D-485H ; 膠帶總厚度. 90μm. 90μm. 90μm. 85μm ; 黏著力( 紫外線照射前). 5000. 740. 580. 4900.
Technical data sheet download
https://www.lintec-global.com
This is the Technical data sheet download of construction- and automobile-related products of LINTEC Corporation.
UV Cur
https://lintec-usa.com
Reduced wafer warpage with programmable tape tension. □ Programmable cutting angles to reduce wafer damage and provide the cleanest possible cut.
UV Curable Dicing Tape
https://www.adwill-global.com
Dicing Tape D series （UV Curable Dicing Tape） · 1. Secures wafers with strong initial adhesion to ensure dicing without any slipping or peeling even for small ...
UV tape D
https://www.datasheetarchive.c